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Danmarks Tekniske Universitet - DTU
Multi-Chamber High Vacuum Sputtering Deposition System (1)
Danmarks Tekniske Universitet - DTU
Corrigendum
Notice for changes or additional information
Supplies
(Supplement to the Official Journal of the European Union, 2018/S 183-413683)
Directive 2014/24/EU
Section I: Contracting authority/entity
30060946
Anker Engelunds Vej 1
Kgs Lyngby
2800
Denmark
Contact person: Alexi Burns-Tang
Telephone: +45 45251126
E-mail: alexi@adm.dtu.dk
NUTS code: DK
Internet address(es):
Main address: http://www.dtu.dk
Address of the buyer profile: https://eu.eu-supply.com/ctm/Company/CompanyInformation/Index/165863
Section II: Object
Multi-Chamber High Vacuum Sputtering Deposition System (1)
This tender is concerning a multi-chamber high vacuum sputtering deposition system for R and D and pi-lot production applications with focus on high flexibility regarding source materials (metals, semiconductors, and dielectrics), substrate materials and substrate sizes. The system will be used for sputter deposition of various thin films onto standard sized si-wafers (mainly 100 mm and 150 mm) but it should also be possible to load smaller chips using carriers. It should be possible to deposit metal oxides, metal nitrides, and pure metal thin films and semiconductors in various sputtering modes (DC/RF/pulsed DC/HiPIMS/reactive sputtering).
Section VI: Complementary information
Section VII: Changes