FCI announces the HCI® High Power backplane and midplane connector series for additional power at the interface between daughter cards and backplanes or midplanes in chassis-based platforms. These compact 2- and 3-position power modules utilize recently introduced HCI technology to enable increased linear power density along the daughter card edge.

The new products are available at distributor Rutronik now.

The HCI High Power backplane and midplane connectors are intended for host-to-card applications such as the blade, controller card or line card interfaces in servers, storage enclosures, networking or communications equipment.

HCI High Power modules extend beyond the capability of FCI’s proven Hard Metric High Power connector system currently used in many production platforms. HCI High Power is rated for up to 75A per contact without exceeding a 30ºC temperature rise (no airflow). Individual power contacts are surrounded on four sides by molded housing walls resulting in an added safety feature that ensures adjacent power contacts cannot short together. Inaddition to conventional 1 x 2 and 1 x 3 power contact configurations, a 2-position module is available with an integrated guide between the two power contacts.

The series offers up to 261A/inch linear power density and is based on standard and costeffective stamped-and-formed power contact technology.

All product information stated in the current press release is based on the
franchise situation in Germany. Country specific variations may therefore
be possible.
www.rutronik.com