ASSMANN WSW components has expanded the product range with new pin heat sinks. These pin heat sinks provide an excellent thermal efficiency due to the flow-favouring fin geometry. With the easy assembly by thermally conductive adhesive foil or thermally conductive adhesive these heat sinks offer a fast and easy solution for heat dissipation.

The new product is available at distributor Rutronik now.

Advantages of the pin heat sinks for BGA (Ball Grid Array) or PGA (PIN Grid
Array) are optimal volume o fair flow by appropriate arrangement and number
of pins, a constant heat distribution in the basis and in the pins in heat
flow direction, a small weight by optimized geometry plus and the component
mounting by thermal conductive adhesive or thermal conductive adhesive foil.

Contact Rutronik:
Roland Hofmann, Product Sales Manager
roland_hofmann@rutronik.com
Tel.: +49 (0)7231/ 801 -0

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All product information stated in the current press release is based on the
franchise situation in Germany. Country specific variations may therefore
be possible.